Journal of Welding and Joining

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34 Articles

Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer: Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim; J Weld Join. 2021;39(4):402-408. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.8
Cited By 1; Full text PubReader ePub PDF

Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test: Kyung-Yeol Kim, Haksan Jeong, Sang-Woo Kim, Jae-Oh Bang, Seung-Boo Jung; J Weld Join. 2020;38(2):145-151. Published online April 22, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.3; Full text PubReader ePub PDF

The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module: Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung; J Weld Join. 2019;37(2):1-6. Published online April 25, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.1
Cited By 1; Full text PubReader ePub PDF

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2018;36(5):52-60. Published online September 17, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.5.7
Cited By 3; Full text PubReader ePub PDF

Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate: Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung; J Weld Join. 2018;36(2):14-20. Published online April 30, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.2.3
Cited By 2; Full text PubReader ePub PDF

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2017;35(6):51-58. Published online December 4, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.6.8
Cited By 6; Full text PubReader ePub PDF

Friction Stir Welding of Ferritice Stainless Steel: Byung-Wook Ahn, Don-Hyun Choi, Yun-Mo Yeon, Seung-Boo Jung; J Weld Join. 2014;32(2):140-143. Published online May 14, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.2.14; PDF

Researches in Corrosion Resistance of Friction Stir Welded Aluminum alloys: Byung-Wook Ahn, Don-Hyun Choi, Yun-Mo Yeon, Seung-Boo Jung; J Weld Join. 2013;31(2):21-25. Published online June 5, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.2.21; PDF

Manufacturing and Properties of Metal Based Composite Produced By Friction Stir Processing: Don-Hyun Choi, Yun-Mo Yeon, Seung-Boo Jung; J Weld Join. 2012;30(5):27-33. Published online November 30, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.5.27; PDF

Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate: Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn et al.; J Weld Join. 2012;30(5):64-69. Published online November 30, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.5.64; PDF

Friction Stir Spot Welding of Light Non Ferrous Metal for Automobile: Don-Hyun Choi, Yun-Mo Yeon, Seung-Boo Jung; J Weld Join. 2011;29(5):24-30. Published online November 22, 2011; PDF

Friction Stir Welding of Duplex Stainless Steel: Don-Hyun Choi, Byung-Wook Ahn, Yun-Mo Yeon, Seung-Boo Jung; J Weld Join. 2010;28(5):38-44. Published online November 5, 2010; PDF

Recent Studies on Friction Stir Welding of High Carbon Steels: Yun-Mo Yeon, Don-Hyun Choi, Byung-Wook Ahn, Chang-Yong Lee, Jong-Bong Lee, Seung-Boo Jung; J Weld Join. 2009;27(5):28-33. Published online November 16, 2009; PDF

Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film: Young-Chul Lee, Jong-Woong Kim, Kwang-Seok Kim, Chong-Hee Yu, Seung-Boo Jung; J Weld Join. 2009;27(3):32-37. Published online July 6, 2009; PDF

Friction Stir Spot Welding of Steel Alloy: Chang-Yong Lee, Don-Hyun Choi, Yun-Mo Yeon, Won-Chan Seo, Seung-Boo Jung; J Weld Join. 2008;26(6):12-17. Published online January 13, 2009; PDF

Friction Stir Welding of Stainless Steels: Yun-Mo Yeon, Chang-Yong Lee, Don-Hyun Choi, Jong-Bong Lee, Seung-Boo Jung; J Weld Join. 2008;26(6):30-35. Published online January 13, 2009; PDF

Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink: Ja-Myeong Koo, Jong-Bum Lee, Sang-Su Ha et al.; J Weld Join. 2008;26(2):37-42. Published online June 18, 2008; PDF

Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):37-43. Published online March 21, 2008; PDF

Electrical Characterization of Electronic Package: Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):17-23. Published online March 21, 2008; PDF

Ultrasonic Bonding Technology for Flip Chip Packaging: Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.; J Weld Join. 2008;26(1):31-36. Published online March 21, 2008; PDF

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder: Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung; J Weld Join. 2007;25(5):78-83. Published online January 28, 2008; PDF

Flip-chip Bonding Technology and Reliability of Electronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.; J Weld Join. 2007;25(2):6-15. Published online May 17, 2007; PDF

Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement: Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung; J Weld Join. 2007;25(2):16-23. Published online May 17, 2007; PDF

Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application: Sang-Su Ha, Jong-Woong Kim, Jong-Hyuck Chae et al.; J Weld Join. 2006;24(6):21-27. Published online February 12, 2007; PDF

Evaluation of Thermal Property and Fluidity with Underfill for BGA Package: Bo-In Noh, Bo-Young Lee, Soo-Jung Kim, Seung-Boo Jung; J Weld Join. 2006;24(2):57-63. Published online July 18, 2006; PDF

Application of MEMS Technology in Microelectronic Packaging: Jong-Woong Kim, Dae-Gon Kim, Won-Chul Moon, Jeong-Hoon Moon, Chang-Chae Shur, Seung-Boo Jung; J Weld Join. 2006;24(2):34-41. Published online July 18, 2006; PDF

Fabrication of Through-hole Interconnect in Si Wafer for 3D Package: Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.; J Weld Join. 2006;24(2):64-70. Published online July 18, 2006; PDF

[Research Papers] Joint Characteristics of Spot Friction Stir Welded A 5052 Alloy Sheet: Yun-Mo Yeon, Won-Bae Lee, Chang-Yong Lee, Seung-Boo Jung, Keun Song; J Weld Join. 2006;24(1):71-76. Published online April 3, 2006; PDF

Joint properties and Interface Analysis of Friction Stir Welded Dissimilar Materials between Austenite Stainless Steel and 6013 Al Alloy: Won-Bae Lee, Gehard Biallas, Martin Schmuecker, Seung-Boo Jung; J Weld Join. 2005;23(5):62-69. Published online November 11, 2005; PDF

Spot Friction Stir Welding and Characteristics of Joints in Aluminium Alloys: Yun-Mo Yeon, Chang-Yong Lee, Won-Bae Lee, Seung-Boo Jung, Woong-Seong Chang; J Weld Join. 2005;23(3):16-20. Published online July 15, 2005; PDF

Core Technology of Electronic Packaging: Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung; J Weld Join. 2005;23(2):10-17. Published online May 12, 2005; PDF

Analysis Method of Metallic Ion Migration: Won-Sik Hong, Seung-Boo Jung, Kwang-Bae Kim; J Weld Join. 2005;23(2):32-40. Published online May 12, 2005; PDF

Effects of Welding Parameters on the Friction Stir Weldability of 5052 AI alloy: Won-Bae Lee, Sang-Won Kim, Chang-Young Lee et al.; J Weld Join. 2004;22(3):69-76. Published online September 15, 2004; PDF

Joinability of Tool Steels by TLP Bonding: Byung-Dae Kwon, Won-Bae Lee, Bong-Soo Kim, Tae-Whan Hong, Chang-Chae Shur, Seung-Boo Jung; J Weld Join. 2003;21(4):69-74. Published online August 25, 2003; PDF

Volume 42, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

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3,959	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,878	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
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